KOCH CHEMIE PADS

Micro Cut finishing pad uses a high-quality special sponge for removing fine scratches, holograms, and polishing marks using the Micro Cut M3.02 po...

This Koch Chemie polishing pad is a medium abrasive sponge for removing moderate weathering and scratches using the Koch Chemie Fine Cut F6.01 poli...

The Koch Chemie Heavy Cut Buffer Pad uses an abrasive sponge for removing strong weathering and deep scratches. The short height of 23mm creates lo...

Medium abrasive sponge for removing moderate weathering and scratches using the One Cut and Finish P6.01. The short height of 23mm creates low tor...